[分享]高亮度LED封裝工藝及方案 [復(fù)制鏈接]

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隨著手機(jī)閃光燈、大中尺寸（NB、LCD-TV等）顯示屏光源模塊以至特殊用途照明系統(tǒng)之應(yīng)用逐漸增多。末來再擴(kuò)展至用于一般照明系統(tǒng)設(shè)備，采用白光LED技術(shù)之大功率（High Power）LED市場將陸續(xù)顯現(xiàn)。在技術(shù)方面，現(xiàn)時(shí)遇到最大挑戰(zhàn)是提升及保持亮度，若再增強(qiáng)其散熱能力，市場之發(fā)展深具潛力。 i2EXE0;  
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With the increasing application of mobile flashlight, large and medium sizes displays (NB, LCD-TV), illumination system in special usage and other future development in illumination devices, high power LED with white light LED in entering the market in succession. The biggest challenge present is how to raise and keep the brightness. If the capability of heat radiating can be boosted up, the technology will have more powerful market potential. /Af:{|'$%